October 7-11, 2019 ᛫ Golden, Colorado


Register Now!
Remember to book your room while event discounts apply!

We’re excited about our growing list of presenters who will focus on this year’s theme, Trust Digital.

Wynne Odell, CEO, Odell Brewing
Tim Priser, Lockheed Martin
Chris Schreiber, Lockheed Martin
Devin Barnes, Lockheed Martin
Brian Kaplun, Lockheed Martin
Jose Resendis, Raytheon
Ben Kassel, LMI
Sylvere Krima, Engisis
Charles Culp, Essex Industries
Nick Eplin, Essex Industries
Kevin Sari, Leonardo DRS
Alex Boehm, United Launch Alliance
Myon Caruthers, Honeywell FM&T
Casey Nordwald, ULA
Sarah Hale, Sandia
Benny Yap, Cisco
Evan Kessick, GE Appliances
Philip Jennings, Huntington Ingalls|Newport News Shipbuilding
Leslie Peters, CEO Metro Aerospace
Toby Maw, Manufacturing Technology Centre
Keith Coughlin, Lockheed Martin
Dick Tiano, ATI

The 3D Collaboration & Interoperability Congress (3D CIC) fosters concentrated conversations about CAD-agnostic digital methods for Model-Based Enterprise advancement. 3D CAD thought leaders from commercial and government organizations present their stories of success, challenge, business strategy, and technology solutions. Intimate conversation and collaboration among industry attendees and 3D CAD interoperability vendors enhances Industry 4.0 and Digital Thread initiatives. Medical, aerospace, defense, electronics, automotive, industrial equipment, and product development industries from small to large organizations are represented at this annual event

“This congress provided a unique opportunity to learn the real state
and direction of this critical part of CAD technology.

It provides key information that we need to set expectations and priorities
and to develop a realistic road map.”

Wayne C., Autodesk – 2018 3D CIC Attendee

3D CIC focuses on 3D CAD collaboration and interoperability for the entire product lifecycle. Trust Digital is the 2019 theme, showcasing organizations that have evolved to trusting digital: tracking their product’s condition digitally at each stage of the product lifecycle. Product pedigree is achieved through recording not just how we design a product, but how we make it, measure it, report it, and improve it. Join us at 3D CIC 2019 to explore 3D data traceability and interoperability for 3D digital data sets.

The 3D Collaboration & Interoperability Congress focuses on CAD collaboration and interoperability for the entire product lifecycle. Action Engineering produces 3D CIC with the support of 3D CIC’s founder and long-time lead, David Prawel of Longview Advisors. Action Engineering is grateful for Mr. Prawel’s continued support of 3D CIC.