3D Collaboration & Interoperability Congress + Quality Information Framework Summit

October 2-6, 2017  >>  Golden, Colorado  >>  REGISTER NOW

3D CIC


3D CIC + QIF Summit 2017 Theme:
UNITE: Engineering & Shop Floor Collaboration


The 3D Collaboration & Interoperability Congress focuses on CAD collaboration and interoperability for the entire product lifecycle. More than ever before, information needs to be digital and fully associated as Model-Based Definition (MBD), Model-Based Enterprise (MBE), Smart Manufacturing, and Internet of Things (IoT) continue to evolve. For discrete manufacturing, this means CAD interoperability and collaboration to enable the digital thread.

3D CIC returns to Golden, Colorado for the 2017 event, with the theme: UNITE: Engineering & Shop Floor Collaboration. Real users share their experiences for all stages of the product lifecycle, with the focus on real-world challenges and solutions for turning design concepts into manufacturing product reality using 3D models.

New this year is the coordination of the Quality Information Framework (QIF) Summit with 3D CIC, through partnership with the Dimensional Metrology Standards Consortium (DMSC). Comprising the QIF Summit are the biennial QIF Symposium, QIF Working Group meetings, and a DMSC member meeting. 3D CIC has expanded to three days to feature the QIF Symposium on the third day. The three-day joint event will be held October 3-5, 2017.

DMSC’s mission includes promoting the development and interoperability of standards that support dimensional metrology, such as the QIF ANSI standard. The Quality Information Framework enables the capture, use, and reuse of metrology-related information throughout the Product Data/Lifecycle Management (PDM/PLM) domain. The QIF Symposium will focus on the benefits and implementation success stories of the QIF standard from real users.

Watch this video for an introduction to the Quality Information Framework.

An event about collaboration and interoperability would be nothing without networking. The 3D CIC + QIF Summit joint event is intentionally organized to maximize information sharing and networking with intimate seating (consider unplugging from your laptop), ample breaks, and three happy hour receptions.

CAD user groups for Model-Based Definition/Enterprise are returning for 2017! Find out more about the NX, SOLIDWORKS, PTC, and Inventor user groups on the Agenda page

Action Engineering produces 3D CIC with the support of 3D CIC’s founder and long-time lead, David Prawel of Longview Advisors. We are grateful for Mr. Prawel’s continued support.

Latest 3D CIC posts

  • Anark: Connecting the Digital Thread Jennifer Herron, CEO of Action Engineering, interviewed Stephen Collins, CEO of Anark Corporation, for this featured blog about 3D CAD collaboration and interoperability. Action Engineering appreciates Anark's generous support as a Signature Sponsor of the 2017 3D Collaboration & Interoperability… READ MORE >
  • Charting the Transition from Engineering to Inspection through Quality Reporting Glen Voglesong of Faurecia-Automotive Seating Business Group-NAO will present at the 2017 Quality Information Framework (QIF) Symposium. The 3D Collaboration & Interoperability Congress (3D CIC) and the QIF Symposium will be held in Golden, Colorado on October 3-5, 2017. Presentation Charting the… READ MORE >
  • Golden Eats & Sights – 2017 Favorites Are you coming to Golden, Colorado for the 2017 3D Collaboration & Interoperability Congress + Quality Information Framework Summit? Here we present Action Engineering’s favorite eats and sights around downtown Golden, all within short walking distance of the American Mountaineering Center,… READ MORE >
  • 3D CIC + QIF Summit 2017 Sponsor Presentations Signature and CAD & Cocktails sponsors of the 2017 3D Collaboration & Interoperability Congress (3D CIC) + Quality Information Framework (QIF) Symposium will give presentations at the event in Golden, Colorado during the week of October 2, 2017. Presenter photos and bios… READ MORE >
  • Weaving a Digital Thread for Manufacturing: STEP, QIF, and MTConnect Dr. Martin Hardwick of Rensselaer Polytechnic Institute will present at the 2017 Quality Information Framework (QIF) Symposium. The 3D Collaboration & Interoperability Congress (3D CIC) and the QIF Symposium will be held in Golden, Colorado on October 3-5, 2017. Presentation Weaving a… READ MORE >