William Cockrell of Raytheon – 3D CIC 2017 Keynote Speaker

William Cockrell of Raytheon Missile Systems will deliver one of the keynote addresses at the 2017 3D Collaboration and Interoperability Congress. 3D CIC and the Quality Information Framework Symposium will be held in Golden, Colorado on October 3-5, 2017.

Presentation

The Future Can Improve Your Past

  • Manufacturing deals with bad designs and drives solutions to resolve them.
  • Inclusion of manufacturing and other downstream stakeholders in the early design phase reduces changes and schedule slips later.
  • Drives designs that allow for component reuse and more robust assemblies.

Presenter

William Cockrell
Sr. Principal Technical Support Engineer
Raytheon Missile Systems
 
William Cockrell is the Model-Based Definition (MBD) champion at Raytheon Missile Systems (RMS) in Tucson, AZ. He is a Subject Matter Expert for the Raytheon MBD enterprise team. Mr. Cockrell has been leading the engineering transition to MBD for over four years through the development of enterprise standards, processes, configuration, and training to support pilots and program adoption at RMS. He is a voting member on ASME Y14.41 and Y14.47 and is a member of the working group that formerly supported the PTC Model Centric Technical Committee.
 

3D CIC + QIF Symposium

The 3D Collaboration & Interoperability Congress featuring the Quality Information Symposium focuses on 3D CAD collaboration and interoperability for the entire product lifecycle. With the 2017 theme of UNITE: Engineering & Shop Floor Collaboration, real users share their experiences with turning design concepts into manufacturing product reality using 3D models. The joint 3D CIC and QIF Symposium event will be held October 3-5, 2017 at the American Mountaineering Center in Golden, Colorado. Find out more and register for 3D CIC + QIF Symposium at 3dcic.com.

3D CIC 2016 Orange Letters 1200 x 147 pixels

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