Capturing Product Behavioral and Contextual Characteristics through MFIN

Presentation

Keith CoughlinCapturing Product Behavioral and Contextual Characteristics through MFIN by Keith Coughlin, Lockheed Martin Aeronautics

Model-Based Feature Information Network enables automation of manufacturing processes in the domains of Design, Analysis, Process Planning, Quality Inspection, Maintenance, Repair and Overhaul.

Computer Aided Design (CAD) software that is used to design mechanical components continues to evolve as well as the Product Lifecycle Management (PLM) processes that manage this data, but the transfer of this information to anyone in the enterprise that will interact with the product has changed very little in the last few decades. On the horizon is Model-Based Definition (MBD) that entails designing not only the product geometry in CAD but also all the information needed to manufacture, inspect, and sustain the product. The MxD 15-11 project addresses the industry need for a way to meaningfully capture and connect such information at the CAD feature level and across all the various domains of industrial manufacturing.

PresenterLockheed Martin

Keith Coughlin
Senior Applications Engineer – Systems Technology Development
Lockheed Martin Aeronautics

Keith Coughlin with Lockheed Martin Aeronautics is a Senior Applications Engineer within the Manufacturing & Systems Technology department assigned to work Model Based Enterprise initiatives. As a Program Manager, he is operating on applications relative to information flow and adapting data intensive processes to maximize effectiveness within the domains of operations and information technologies for Product Lifecycle Management. Achievements include Textron Certified Six Sigma Green Belt from Bell Helicopter, Mechanical Engineering Master of Science from Southern Methodist University and a Model-Based Definition Certification from Purdue University.

MFIN is based on the Quality Information Framework (QIF). Keith and Rosemary’s topics will include supply chain FAI measurement feedback, closing the loop digitally between Design and Quality – including a live demonstration of these capabilities.  Should be a good discussion at 3D CIC 2019.
Jennifer Herron, CEO of Action Engineering
#siemens #qif #mbd #digitalmetrology #purdue #rollsroyce #lockheedmartin
#nx #billofcharacteristics #digitalfai #mbd #automatedinspection

3D Collaboration & Interoperability Congress

The 3D Collaboration & Interoperability Congress (3D CIC) focuses on 3D CAD collaboration and interoperability for the entire product lifecycle. The 2019 theme of Trust Digital showcasing organizations that have evolved to trusting digital: tracking their product’s condition digitally at each stage of the product lifecycle. 3D CIC 2019 will be held October 7-11, 2019 at the Buffalo Rose Events Center in Golden, Colorado. Find out more and register at 3dcic.com.

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