GEA’s Digital Journey Using QIF + 3D Scanning

Presentation

GE AppliancesGEA’s Digital Journey Using QIF + 3D Scanning by Evan Kessick and David Leone, GE Appliances

Machine vs. Human Readability: How we employ QIF and 3D Scanning

GE Appliances is in the business of making machines and humans work together every day. Not only in the kitchen and laundry room, but on the shop floor as well.  We’ll share GEA’s modern approach to the digital journey and how we Trust Digital including our investment in people, looking at data as machine readable and/or people readable. We’ll include how we incorporate QIF and digital metrology, 3D scanning, timelines, and yes, our “aha” moment.

Presenters

Evan Kessick
Principal Engineer – Model-Based Enterprise
GE Appliances

Evan Kessick is a Principal Engineer, implementing Model-Based Enterprise (MBE) at GE Appliances. Providing guidance and support to cross-functional teams to leverage, reuse, and share PMI/QIF data efficiently across the business. Defining and driving new strategies to lean out non-value-added derivative data creation and implementing new tools to push GEA’s competitive edge. ASME Certified Professional GDTP-S.

 

Dave Leone GE AppliancesDave Leone
Director, Engineering – Dimensional Control
GE Appliances

Dave Leone is at the forefront of driving a Dimensional Management revolution at GE Appliances. GEA is redefining its product development processes by developing deep technical expertise in Geometric Dimensioning and Tolerancing (GD&T), Functional Gaging, Model-Based Enterprise (MBE), Model-Based Tolerance Analysis, and Model-Based Quality using 3D Scanning.

“I’m really looking forward to hearing a modern approach to the digital journey.  Evan and Dave will talk about their investment in people, looking at data as machine readable and/or people readable, and how they employ QIF and digital metrology on the factory floor.  We can expect detailed timelines, and explanations of their journey over time. Come find out what their “aha” moment is at 3D CIC 2019.” 
Jennifer Herron, CEO Action Engineering

#creo #windchill #semantic #symbols #ppap #toleranceanalysis
#mbdvidia #3dcs #qif #polyworks #billofcharacteristics

3D Collaboration & Interoperability Congress

The 3D Collaboration & Interoperability Congress (3D CIC) focuses on 3D CAD collaboration and interoperability for the entire product lifecycle. The 2019 theme of Trust Digital showcasing organizations that have evolved to trusting digital: tracking their product’s condition digitally at each stage of the product lifecycle. 3D CIC 2019 will be held October 7-11, 2019 at the Buffalo Rose Events Center in Golden, Colorado. Find out more and register at 3dcic.com.

3D CIC 2016 Orange Letters 1200 x 147 pixels

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