Lockheed Martin Digital Transformation

Presentation

Lockheed Martin Panel Collage of 3 men and 1 woman in dark jackets with Lockheed Martin LogoLockheed Martin Digital Transformation

Driving innovation across the product lifecycle.

The Lockheed Martin panel will cover an overview of model-based systems engineering strategy, applications for quality analysis, and advancements in the additive manufacturing arena and how this transformation drives innovation across the product lifecycle. Participants will highlight successes, as well as challenges, along the transformation journey and what is happening next. An interactive audience participation session will include topic selections crowd-sourced through the 3D CIC conference app as well as a freeform question and answer session. Join this session to hear about ways to apply digital methods across your organization and get a variety of perspectives on tools to help your teams adopt a new mindset to Trust Digital!

Have your 3D CIC mobile app at the ready, as there is some fun audience engagement planned for the second half of the Lockheed team presentation!

PresentersLockheed Martin Logo

Dani Hauf, LM Space Digital Transformation Communications,  Moderator
Chris Schreiber, MBSE and Corporate Digital Transformation
Brian Kaplun, Additive Manufacturing
Devin Barnes, AQT and Digital Quality Techniques

Chris Schreiber is a Systems Engineering Senior Manager for Lockheed Martin Space with responsibility for the Systems Engineering Modernization department focused on supporting programs with Model-Based Systems Engineering, Agile Systems Engineering, and Augmented Reality capabilities. For the past 8 years Chris has been focused on developing and deploying MBSE practices, training and infrastructure at Space Systems. He has led a number of Model-Based Engineering and Systems Engineering pilots, IRADs and implementations, including Systems Engineering efforts for Lockheed Martin’s Digital Tapestry Initiative. Chris has 20+ years of experience in a variety of industries ranging from Management Consulting to Manufacturing to Aerospace. Chris is active in a number of industry associations as a member of INCOSE and OMG, chairing the Model & Simulation Committee for the National Defense Industrial Association (NDIA) Systems Engineering Division, and works on development efforts for SysML 2.0. He also serves as a Corporate Advisory Board member for Englewood Public Schools’ STEM initiative.

Currently a Staff Materials and Process engineer working in Lockheed Martin’s Space division located in Littleton, CO, Devin Barnes is responsible for providing central materials and process support. Prior to this role, Devin served on the Radiography team working in their non-destructive testing/evaluation department providing all forms of X-ray radiographic support including computed tomography (CT). For over 12 years, Devin has held various engineering and technical leadership positions that have spanned aerospace, defense, medical, and commercial sectors all revolving around manufacturability. Most relevant to 3D Collaboration and Interoperability Congress, is his experience as a Senior Research scientist in Sunnyvale, CA helping stand up and characterize laser powder bed fusion and being a casting engineer for PCC Structurals, Inc. which spanned design, dimensional, process, and hardware quality acceptance. My passion lies in hands-on mechanical engineering, pragmatic solutions, and model-based design with particular focus in Additive Manufacturing.

Brian Kaplun is an Advance Manufacturing Senior Manager for Lockheed Martin Space with thirteen years of experience at the company. Managing production operations featuring fused deposition modeling, laser powder bed and electron beam equipment Brian has helped produce over 15,000 pars per year. He is also been responsible for the productionizing and flight certifying additive and advanced materials components for over a dozen helicopters, fixed wing aircraft, planetary missions, human space flight and satellite platform missions. Author of six patents on additive manufacturing thermal management and avionics construction techniques. Brian has his Bachelor’s in Science in Mechanical Engineering, Masters of Engineering in Material Science and Engineering and is currently a PhD Candidate at the University of Colorado.

 

3D Collaboration & Interoperability Congress

The 3D Collaboration & Interoperability Congress (3D CIC) focuses on 3D CAD collaboration and interoperability for the entire product lifecycle. The 2019 theme of Trust Digital showcasing organizations that have evolved to trusting digital: tracking their product’s condition digitally at each stage of the product lifecycle. 3D CIC 2019 will be held October 7-11, 2019 at the Buffalo Rose Events Center in Golden, Colorado. Find out more and register at 3dcic.com.

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