Benny Yap of Cisco Systems will present at the 2017 3D Collaboration and Interoperability Congress. 3D CIC and the Quality Information Framework Symposium will be held in Golden, Colorado on October 3-5, 2017.
How Supply Chain Can Drive MBE
Many product design validation processes require interaction and data from the Supply Chain ecosystem, such as Design for Manufacturing, Assembly, Cost, and Variation Management.
Supply Chain is well positioned to provide insights on the MBE value chain as well as execute upon the MBE requirements, being both a consumer and customer of Engineering’s output and Technical Data Packages.
The reciprocation of Engineering’s consumption of Supply Chain’s data on manufacturing capability allows Supply Chain to affect the product design and requirements.
This presentation will take you through the journey of how Supply Chain was able to recognize the MBE potential, gather constituents, develop the strategy, and drive the initiative for the corporation.
Technical Leader, Supply Chain Operations, Technology, and Quality Division
Cisco Systems, Inc.
Benny Yap is a Technical Leader for Cisco Systems Supply Chain Operations, Technology, and Quality Division. He has over 22 years of experience in product design, development, and manufacturing. He started his career as a Body Design Engineer at Honda R&D Americas designing the Acura CL, TL, MDX, and Honda Accord Coupe product models. Previous to joining Cisco, Benny was a Manufacturing Quality Control Engineering Project Leader at New United Motors Manufacturing Inc. for the first Toyota Tacoma Quad Cab product model. His tenure at Cisco has included a New Product Introduction Engineering role and over 10 years in Engineering Management for the High End Core Routing System product line. His extensive experience and knowledge in different industries and roles led him to his current responsibilities for mechanical technology and innovation exploration, development, and implementation for Cisco Operations. Benny received his B.S. in Mechanical Engineering from the University of Utah.
3D CIC + QIF Symposium
The 3D Collaboration & Interoperability Congress featuring the Quality Information Symposium focuses on 3D CAD collaboration and interoperability for the entire product lifecycle. With the 2017 theme of UNITE: Engineering & Shop Floor Collaboration, real users share their experiences with turning design concepts into manufacturing product reality using 3D models. The joint 3D CIC and QIF Symposium event will be held October 3-5, 2017 at the American Mountaineering Center in Golden, Colorado. Find out more and register for 3D CIC + QIF Symposium at 3dcic.com.