MBD-enabled and MBE-connected quality management and compliance using the power of the QIF and software automation.
Model-Based Definition enabled an innovative approach for the Product Design Engineer to communicate and collaborate with manufacturing using a digital technical data package. However, MBD has more potential than TDP communication and collaboration but can also be applied towards product and part quality through the digital thread connectivity as the product design data and requirements are fully defined in the CAD model and can be leveraged to drive product quality and compliance. This session will present how Cisco is enabling digital product quality inspection and management using the power of the MBD CAD model and the Quality Information Framework standard, creating an end-to-end digital quality platform.
Senior Technical Leader
Cisco Systems Inc.
Benny Yap is a Senior Technical Leader for Cisco Systems Supply Chain Operations, Technology and Quality Division. He received his Bachelor of Science in Mechanical Engineering from the University of Utah and has over 22 years of experience in product design, development, and manufacturing. His career experiences includes a Body Design Engineer at Honda R&D Americas, a Quality Control Manufacturing Project Leader at Toyota, and most recently, a Senior Technical Leader at Cisco Systems driving the electro-mechanical product development vision. His tenure at Cisco includes over 10 years in Senior Engineering Management for various high-end core routing systems, to developing and implementing high level organizational and operations strategies. His current electro-mechanical product development vision is an orchestration of digital product development capabilities applying automated analytics, through a connected supply chain, enabling the Model-Based Enterprise for Cisco. He received a Frost and Sullivan Manufacturing Leadership Award and an internal Develop@Cisco Award for his digital strategy and vision.
3D Collaboration & Interoperability Congress
The 3D Collaboration & Interoperability Congress (3D CIC) focuses on 3D CAD collaboration and interoperability for the entire product lifecycle. The 2018 theme of Enterprise Accountability will bring together real users to share experiences and learn about the topics of Culture & Champions, Quality, and Manufacturing. 3D CIC 2018 will be held October 15-18, 2018 at the American Mountaineering Center in Golden, Colorado. Find out more and register at 3dcic.com.