Jennifer Herron, CEO of Action Engineering, interviewed Raphael Nascimento, CADIQ Product Manager at International TechneGroup Inc. (ITI), for this featured blog about 3D enterprise accountability. Action Engineering appreciates ITI’s generous support as a Signature Sponsor of the 2018 3D Collaboration & Interoperability Congress in Golden, Colorado on October 15-18, 2018. Can You Trust Your Models? […]
Enterprise Accountability: Striking a Balance through Technology & Automation
Jennifer Herron, CEO of Action Engineering, recently interviewed Swadhin Bhide, Director of Products & Technologies at HCL Technologies, for this featured blog about 3D enterprise accountability. Action Engineering appreciates HCL’s generous support as a Signature Sponsor of the 2018 3D Collaboration & Interoperability Congress in Golden, Colorado on October 15-18, 2018. Enterprise Accountability: Striking a […]
Anark: Connecting the Digital Thread
Jennifer Herron, CEO of Action Engineering, interviewed Stephen Collins, CEO of Anark Corporation, for this featured blog about 3D CAD collaboration and interoperability. Action Engineering appreciates Anark’s generous support as a Signature Sponsor of the 2017 3D Collaboration & Interoperability Congress + Quality Information Framework Summit, being held in Golden, Colorado on October 2-6, 2017. […]
3D CIC + QIF Summit 2017 Sponsor Presentations
Signature and CAD & Cocktails sponsors of the 2017 3D Collaboration & Interoperability Congress (3D CIC) + Quality Information Framework (QIF) Symposium will give presentations at the event in Golden, Colorado during the week of October 2, 2017. Presenter photos and bios are provided in order of appearance (click for full agenda). Siemens PLM Software // CAD […]
Spatial Corp: Accelerate 3D Innovation
Jennifer Herron, CEO of Action Engineering, interviewed David Hornsby, Senior Product Manager of Spatial Corp., for this featured blog about 3D CAD collaboration and interoperability. Action Engineering appreciates Spatial’s generous support as a Signature Sponsor of the 2017 3D Collaboration & Interoperability Congress + Quality Information Framework Summit, being held in Golden, Colorado on October […]
ITI’s Proven Interoperability Solutions Create Momentum for MBD
Jennifer Herron, CEO of Action Engineering, interviewed Raphael Nascimento, CADIQ Product Manager at International TechneGroup (ITI), for this featured blog about 3D CAD collaboration and interoperability. Action Engineering appreciates ITI’s generous support as a Signature Sponsor of the 2017 3D Collaboration & Interoperability Congress + Quality Information Framework Summit, being held in Golden, Colorado on […]
Early Pricing Ends July 31 for 3D CIC + QIF Symposium
Register now to take advantage of early pricing for the 3D Collaboration & Interoperability Congress + Quality Information Framework Symposium. Early pricing ends on July 31, 2017 – just 53 days away! Only 97 seats remain for 3D CIC + QIF Symposium! View Speaker Lineup See Sponsor Opportunities (deadline: July 31) [table id=8 responsive=collapse /] MANY […]
Tech Soft 3D: At the Heart of CAD Interoperability
Jennifer Herron, CEO of Action Engineering, recently interviewed Dave Opsahl, VP Corporate Development for Tech Soft 3D, for this featured blog about 3D CAD collaboration and interoperability. Action Engineering appreciates Tech Soft 3D’s generous support as a Signature Sponsor of the 2016 3D Collaboration & Interoperability Congress, held in Golden, Colorado on October 25 & […]
