Presentation Capturing Product Behavioral and Contextual Characteristics through a Model-Based Feature Information Network (MFIN) (DMDII 15-11-08) DMDII project update on MFIN: moving MBD beyond geometry and 3D annotations to address the larger product lifecycle. Computer Aided Design (CAD) software used to design mechanical parts continues to evolve, and Product Lifecycle Management (PLM) processes continue to […]
Weaving a Digital Thread for Manufacturing: STEP, QIF, and MTConnect
Dr. Martin Hardwick of Rensselaer Polytechnic Institute will present at the 2017 Quality Information Framework (QIF) Symposium. The 3D Collaboration & Interoperability Congress (3D CIC) and the QIF Symposium will be held in Golden, Colorado on October 3-5, 2017. Presentation Weaving a Digital Thread for Manufacturing: STEP, QIF, and MTConnect Sending models to manufacturing machines enables intelligent […]