Join us for a 3D CIC: Home Edition virtual event on November 9, 2020, with expert representatives from the ASME, DMSC, SAE, DEDMWG, ISO TC 184/SC 4, and MTConnect standards organizations. This roundtable discussion of interoperability and the ways in which the standards are looking to the future will consider how the standards support 3D CAD interoperability and the challenges they […]
Weaving a Digital Thread for Manufacturing: STEP, QIF, and MTConnect
Dr. Martin Hardwick of Rensselaer Polytechnic Institute will present at the 2017 Quality Information Framework (QIF) Symposium. The 3D Collaboration & Interoperability Congress (3D CIC) and the QIF Symposium will be held in Golden, Colorado on October 3-5, 2017. Presentation Weaving a Digital Thread for Manufacturing: STEP, QIF, and MTConnect Sending models to manufacturing machines enables intelligent […]