Learn Cisco’s MBE story of long long ago and why QIF is the chosen one.
Come along on the Cisco Model-Based Enterprise /MBE Digital Transformation story and learn how the Quality Information Framework/QIF is progressing to becoming the overall digital product quality plan for mechanical hardware products. Applying the power of the digital QIF standard, applying quality requirements and automating quality management will soon become a reality. The presentation will provide a brief overview of Cisco’s MBE Vision, MBE QIF quality approach, and QIF challenges and progression.
Together we will explore:
What is Cisco’s MBE story of long long ago;
Why QIF is the chosen one;
What are the QIF’s dark and light sides;
Where will QIF take Cisco?
Senior Technical Leader, Supply Chain Operations Technology and Quality
Cisco Systems, Inc.
Benny Yap is a Senior Technical Leader for Cisco Systems Supply Chain Operations, Technology and Quality Division. He received his Bachelor of Science in Mechanical Engineering from the University of Utah and has over 22 years of experience in product design, development, and manufacturing. His career experiences includes a Body Design Engineer at Honda R&D Americas, a Quality Control Manufacturing Project Leader at Toyota, and most recently a Senior Technical Leader at Cisco Systems driving the digital electro-mechanical product development vision. His tenure at Cisco includes over 10 years in Senior Engineering Management for various high-end core routing systems, to developing and implementing high level organizational and operations strategies. His current digital electro-mechanical product development vision is an orchestration of digital product development capabilities applying automated analytics, through a connected supply chain, enabling the Model Based Enterprise for Cisco. He received a Frost and Sullivan Manufacturing Leadership Award and an internal Develop@Cisco Award for his digital strategy and vision.
3D Collaboration & Interoperability Congress
The 3D Collaboration & Interoperability Congress (3D CIC) focuses on 3D CAD collaboration and interoperability for the entire product lifecycle. The 2019 theme of Trust Digital showcasing organizations that have evolved to trusting digital: tracking their product’s condition digitally at each stage of the product lifecycle. 3D CIC 2019 will be held October 7-11, 2019 at the Buffalo Rose Events Center in Golden, Colorado. Find out more and register at 3dcic.com.